Xbox One X inside

The latest Microsoft 2017 home game console, the Xbox One X, which features major hardware upgrades focused on enabling games to be rendered at 4K resolution, it’s really impressive, with a SoC of 6 Tflops power from AMD, 12GB GDDR5 and 1TB of inner storage.

Microsoft_Xbox_One_X_000

Really paves the future for the coming years, and faces face to face with its next and closest competitor, Sony’s PS4 Pro (with 4.2 Tflops).

Their acclaimed game controller, due its ergonomy and good response, can be also color tailored, and this Volcano Shadow Special Edition really looks pretty good:

Microsoft_Xbox_One_X_Volcano_controller

And for curiosity, you take a take a close look inside:

Xbox One X Console Explode Dark Gray

And there, you can easily identify the big efforts in RF shielding, Thermal management and board size optimization.

Xperia Z5 Thermal dissipation

Although it was known in the Android community from other high-end smartphones already released this 2015 year that the Qualcomm Snapdragon 810 suffered of overheating in their first die revision (you can take a look to my previous article) it seems that Sony decided go ahead with it in their latest high-end Xperia Z5 family.

Although not mentioned, it is most than probably that Sony is using the die revision 2.x of it, which suffers lower over heating but anyhow noticeable by the user if you use the SoC at maximum throttle (as gaming).

However, it looks like Sony decided to introduce some extra thermal dissipation techniques coming from higher size consumer electronics equipment or computers; more complex but also efficient to spread the heat along the phone, instead of a single heat sink point above the SoC.

In next pictures you can see how Sony added a couple of thermal copper heap pipes connected to a bigger heat sink and even thermal paste on top of the SoC, which makes more complex (and expensive) the inners and assembly of the Z5 phones family, but less noticeable to the user when the SoC warms up:

Sony_Xperia_Z5_Dual_Heat_Pipe

And for the Z5 Premium:

Sony_Xperia_Z5_Premium_Dual_Heat_Pipe

Of course, these kind of techniques are not very usual in high integrated smartphones due the higher manufacturing costs, labor time and lower reliability at long term. I assume that Sony Mobile R&D team had to make some trade-off’s this year to be able to release a newer Z family member with higher specs (currently 810 v2.1 is the highest, while the 820 is ready to be released) able to compete with the strong competition coming from China (as the OnePlus, Huawei, Meizu, Mi, Lenovo/Motorola), Korea (Samsung/LG) and for sure, Apple with their iPhones.

Qualcomm Snapdragon 810 could suffer overheat [Updated x1]

Some months ago there were some rumors saying that the upcoming Qualcomm Snapdragon 810 thought for this 2015 year high-end smartphones had some overheating issues.

snapdragon_processor_810

This was also one of the reasons why those rumors suggested the decision of Samsung to disregard this processor and use only their own Exynos in their Galaxy S6 and S6 Edge new 2015 series.

Well, today Tweakers.net (Dutch specialized site) was evaluating the HTC One M9 (which uses this 810 CPU), and discovered that when high-performance games as Asphalt 8 and Assassin’s Creed are running, the temperature of the M9 case gets much warm that the HTC competitors, in fact, up to 55,4°C.

You can see it in their thermal picture that they made:

CPU_Thermal_Image

It is true that the test was not done with the final SW Android OS build for the HTC One M9, but anyhow it doesn’t show very good perspective. There will be more high-smartphones using this high-end CPU on 2015, so if it is a real issue, we will see more reports like this one and users complaining in the coming months.

[Update x1: 26 March 2015]

After the shocking results shared by Tweakers.net couple weeks ago, HTC released a new Android OS build (claimed to be more stable and closer to the final release) where the temperature of the HTC One M9 is reduced by -13,7°C down to 41,7°C, something closer to its competitors:

cpu_thermal_image_updated

The official details of what was exactly changed has not been officially disclosed by HTC, but pretty sure HTC reduced the processor performance (freq. clocks in some domains) in extreme cases as high demanding 3D games.

Now, we will have to wait for newer HTC One M9 benchmarkings using the tweaked new Android OS build, which still is not the final one, to see if it still can compete face-to-face against latest Samsung Exynos 7 or Apple A8.